Ceramic Packages

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Standard Packages and Lids for Device Evaluation

Kyocera offers a wide variety of standard ceramic packages, including ceramic dual inline packages (C-DIP), ceramic small outline packages (C-SOP), ceramic pin grid array packages (C-PGA), ceramic quad flat packages (C-QFP), ceramic quad flat J-leaded packages (C-QFJ) and ceramic quad flat non-leaded packages (C-QFN). Standard ceramic packages are useful in customer device evaluations and low volume orders, enabling customers to reduce tooling costs and design time. Please contact us for details.

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  • CERQUAD is a registered trademark of KYOCERA Corporation in Japan.

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